Prices are for direct Intel customers, typically represent 1,0. If sold in bulk, price represents individual unit. Listing of RCP does not constitute a formal pricing offer from Intel.# of Cores. Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip). Processor Base Frequency.
- This download installs the Intel® Extreme Tuning Utility (Intel® XTU) version 6.3.0.56.
- Intel® Core
- PC Turbo Boost eliminates unwanted and unused files to help your computer perform like it did when it was new. As your computer's configuration changes over.
- Answers to common questions about Intel® Turbo Boost Technology.
- Model number sSpec number Frequency Turbo Cores L2 cache L3 cache I/O bus Mult. Memory Voltage TDP Socket Release date Part number(s) Release price; Core i7-920.
- Provide more performance with Intel® Turbo Boost Technology 2.0, automatically allowing cores to run faster than the base operating frequency.
- This generational and chronological list of Intel processors attempts to present all of Intel's processors from the pioneering 4-bit 4004 (1971) to the present high.
- Download the latest drivers for your Intel(R) Turbo Boost Technology Driver to keep your Computer up-to-date.
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The Intel Turbo Boost Monitor is a Windows Presentation Format application designed for Windows 7 and 8 which displays processor frequency activity, highlights energy. Download Intel Turbo Boost Technology Monitor. Turbo Boost monitoring tools from Intel.
Processor Base Frequency describes the rate at which the processor's transistors open and close. Frequency is measured in gigahertz (GHz), or billion cycles per second. Cache. CPU Cache is an area of fast memory located on the processor. Types include front- side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point- to- point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point- to- point interconnect between the CPU and the integrated memory controller. TDPThermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel- defined, high- complexity workload. Refer to Datasheet for thermal solution requirements.
Embedded Options Available. Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report.
Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Max Memory Size (dependent on memory type)Max memory size refers to the maximum memory capacity supported by the processor.
Memory Types. Intel. Note that ECC memory support requires both processor and chipset support.
Processor Graphics . See the Intel. Peripheral Component Interconnect Express (or PCIe) is a high- speed serial computer expansion bus standard for attaching hardware devices to a computer.
Highly threaded applications can get more work done in parallel, completing tasks sooner. Intel. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions. Intel. Intel VT- d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments. Intel. Extended Page Tables in Intel. The value shown represents which Intel’s instruction set this processor is compatible with.
Instruction Set Extensions. Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. Conventional Intel Speed.
Step. This technology was introduced as Intel Speed. Step. AES- NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption. Intel. It enables an environment where applications can run within their own space, protected from all other software on the system. Execute Disable Bit .
Anti- Theft Technology. Intel. Allows for delivery and returns. OBObsolete: Inventory available. No future supplies will be available. RPRetired Price: This specific part is no longer being manufactured or purchased and no inventory is available. RTRetired: This specific part is no longer being manufactured or purchased and no inventory is available.
NINot Implemented: No Orders, Inquiries, Quotes, Deliveries Returns, or Shipments. QRQuality/Reliability Hold.
List of Intel microprocessors - Wikipedia. Intel Haswell Core i. CPU, sitting atop its original packaging that contains an OEM fan- cooled heatsink. This generational and chronological list of Intel processors attempts to present all of Intel's processors from the pioneering 4- bit.
Itanium 2 (2. 00. Intel Core i. 7, and Xeon E3 and E5 series processors (2.
Concise technical data is given for each product. First microprocessor (single- chip IC processor)MCS- 4 Family: 4. CPU4. 00. 1 – ROM & 4- bit Port. RAM & 4- bit Port. Shift Register. 40. Memory+I/O Interface. Memory+I/O Interface.
Introduced November 1. General Purpose Byte I/O Port. Programmable General Purpose I/O Device. Programmable Keyboard Display Device. Standard Memory Interface for MCS- 4/4. Each component implemented two bits of a processor function; packages could be interconnected to build a processor with any desired word length.
Members of the family: 3. Microcontrol Unit. Arithmetic Logic Unit slice.
Look- ahead Carry Generator. High- performance 1 of 8 Binary Decoder.
Quad Bipolar- to- MOS Level Shifter and Driver. Hex Sense Amp and Latch for MOS Memories. TTL- to- MOS Level Shifter and High Voltage Clock Driver. ECL- to- MOS Level Shifter and High Voltage Clock Driver.
Multimode Latch Buffer. Interrupt Control Unit. Parallel, Inverting Bi- Directional Bus Driver.
Refresh Controller for 4. K NMOS DRAMs. 32. Parallel, Inverting Bi- Directional Bus Driver. Address Multiplexer and Refresh Counter for 4. K DRAMs. 32. 42 – Address Multiplexer and Refresh Counter for 1. K DRAMs. 32. 45 – Quad Bipolar TTL- to- MOS Level Shifter and Driver for 4. K3. 24. 6 – Quad Bipolar ECL- to- MOS Level Shifter and Driver for 4.
K3. 40. 4 – High- performance 6- bit Latch. Hex Sense Amp and Latch for MOS Memories.
Next generation processor. Bus width 2*n bits data/address (depending on number n of slices used)The 1. MCS- 8. 6 family. It accesses both banks concurrently to read 1. Data bus width 1.
Address bus 2. 0 bits. Later used in portable computing, and in the IBMPS/2 Model 2. Model 3. 0. Also used in the AT& T PC6. Olivetti M2. 4, a popular IBM PC- compatible (predating the IBM PS/2 line).
Used segment registers to access more than 6. KB of data at once, which many programmers complained made their work excessively difficult. This memory capability spurred the development and availability of OS/2 and is a fundamental requirement for modern operating systems like Linux, Windows, and mac. OS. First used by Compaq in the Deskpro 3. Used in desktop computing. Unlike the DX naming convention of the 4. Later renamed Intel.
DXIntroduced June 1. Clock rates. 1. 6 MHz, 2. MIPS2. 0 MHz, 3. 1 MIPS, introduced January 2. MHz, 3. 9 MIPS, introduced January 2. MHz, 5. 1 MIPS, introduced October 2. Internal architecture 3.
External data bus width 1. External address bus width 2. The first version was an 8. DX with disabled math coprocessor in the chip and different pin configuration. If the user needed math coprocessor capabilities, he must add 4.
SX which was actually an 4. DX with different pin configuration to prevent the user from installing a 4. DX instead of 4. 87.
SX, so with this configuration 4. SX+4. 87. SX you had 2 identical CPU's with only 1 effectively turned on. Officially named Intel. SXUsed in low- cost entry to 4.
CPU desktop computing, as well as extensively in low cost mobile computing. Upgradable with the Intel Over.
Drive processor. Family 4 model 2. Runs at twice the speed of the external bus (FSB). Fits in Socket 3.
Clock rates. Officially named Intel. DX2. Family 4 model 3. Introduced November 9, 1. Clock rates. 2. 0 MHz, 1. MIPS2. 5 MHz, 1. 9 MIPS3.
MHz, 2. 5 MIPSBus width 3. P6- based core, now including Streaming SIMD Extensions (SSE)9. KB 1. Model 1. E)Socket 1. LGA2- channel DDR3. Variants. 7. 50. S – 2. GHz/3. 2. 0 GHz Turbo Boost. GHz/3. 2. 0 GHz Turbo Boost.
GHz/3. 3. 3 GHz Turbo Boost. Clarkdale – 3. 2 nm process technology. KB L1 cache. 25. 6 KB L2 cache. MB L3 cache. Introduced January, 2.
Socket 1. 15. 6 LGA2- channel DDR3. Integrated HD GPUAES Support. Variants. 6. 50/6. K – 3. 2 GHz Hyper- Threading Turbo Boost. GHz Hyper- Threading Turbo Boost.
GHz Hyper- Threading Turbo Boost. GHz Hyper- Threading Turbo Boost. Bloomfield – 4. 5 nm process technology. KB L2 cache. 8 MB L3 cache.
Front side bus replaced with Quick. Path up to 6. 4. GT/s.
Hyper- Threading is again included. This had previously been removed at the introduction of Core line. Intel Turbo Boost Technology.
TDP 1. 30. WIntroduced November 1. Socket 1. 36. 6 LGA3- channel DDR3.
Variants. 9. 75 (extreme edition) – 3. GHz/3. 6. 0 GHz Turbo Boost. GHz/3. 4. 6 GHz Turbo Boost. GHz/3. 4. 6 GHz Turbo Boost.
GHz/3. 3. 3 GHz Turbo Boost. GHz/3. 2. 0 GHz Turbo Boost. GHz/3. 0. 6 GHz Turbo Boost. GHz/2. 9. 3 GHz Turbo Boost.
Lynnfield – 4. 5 nm process technology. KB L1 cache. 25. 6 KB L2 cache. MB L3 cache. No Quick. Path, instead compatible with slower DMI interface. Hyper- Threading is included. Introduced September 8, 2. Socket 1. 15. 6 LGA2- channel DDR3.
Variants. 8. 80 – 3. GHz/3. 7. 3 GHz Turbo Boost (TDP 9. W)8. 70/8. 75. K – 2. GHz/3. 6. 0 GHz Turbo Boost (TDP 9. W)8. 70. S – 2. 6. GHz/3. 6. 0 GHz Turbo Boost (TDP 8. W)8. 60 – 2. 8. 0 GHz/3.
GHz Turbo Boost (TDP 9. W)8. 60. S – 2. 5. GHz/3. 4. 6 GHz Turbo Boost (TDP 8.
W)TODO: Westmere. Gulftown – 3. 2 nm process technology. KB L2 cache. 12 MB L3 cache. Front side bus replaced with Quick.
Path up to 6. 4. GT/s. Hyper- Threading is included.
Intel Turbo Boost Technology. Socket 1. 36. 6 LGATDP 1. WIntroduced 1. 6 March 2. Variants. 9. 90. X Extreme Edition – 3. GHz/3. 7. 3 GHz Turbo Boost. X Extreme Edition – 3.
GHz/3. 6. 0 GHz Turbo Boost. GHz/3. 4. 6 GHz Turbo Boost.
Clarksfield – Intel Core i. Mobile Processor Family – 4. Hyper- Threading is included. Intel Turbo Boost Technology. Variants. 9. 40. XM Extreme Edition – 2. GHz/3. 3. 3 GHz Turbo Boost (8 MB L3, TDP 5. W)9. 20. XM Extreme Edition – 2.
GHz/3. 2. 0 GHz Turbo Boost (8 MB L3, TDP 5. W)8. 40. QM – 1. 8. GHz/3. 2. 0 GHz Turbo Boost (8 MB L3, TDP 4. W)8. 20. QM – 1. 7.
GHz/3. 0. 6 GHz Turbo Boost (8 MB L3, TDP 4. W)7. 40. QM – 1. 7. GHz/2. 9. 3 GHz Turbo Boost (6 MB L3, TDP 4. W)7. 20. QM – 1. 6. GHz/2. 8. 0 GHz Turbo Boost (6 MB L3, TDP 4. W)Gainestown – 4.
Same processor dies as Bloomfield. KB L2 cache. 8 MB L3 cache, 4. MB may be disabled.
Quick. Path up to 6. GT/s. Hyper- Threading is included in some models.
Introduced March 2. Variants. W5. 59. X5. 57. 0, X5. 57.
X5. 56. 0, X5. 55. E5. 54. 0, E5. 53. L5. 53. 0, E5. 52. L5. 52. 0, L5. 51. MB L3 cache, HTE5. L5. 50. 6, E5. 50. MB L3 cache, no HTL5.
E5. 50. 2, E5. 50. MB L3 cache, no HT6. Intel 6. 4 – Sandy Bridge / Ivy Bridge microarchitecture. However, numerical codes, in the 8. The following is a list of such product codes in numerical order: Product code. Marketing name(s)Codename(s)8.
Pentium. P5 (A- step)8. Pentium. P5. 80. 50.
Pentium. P5. 4C, P5. CS8. 05. 03. Pentium with MMX Technology. P5. 5C, Tillamook. Pentium Pro. P6. 80.
Pentium IIKlamath. Pentium II, Celeron, Pentium II Xeon. Deschutes, Covington, Drake. Pentium II, Celeron.
Dixon, Mendocino. Pentium III, Pentium III Xeon. Katmai, Tanner. 80. Pentium III, Celeron, Pentium III Xeon.
Coppermine, Cascades. Pentium 4, Xeon. Willamette (Socket 4. Foster. 80. 52. 9canceled. Timna. 80. 53. 0Pentium III, Celeron.
Tualatin. 80. 53. Pentium 4, Celeron. Willamette (Socket 4. Pentium 4, Celeron, Xeon. Northwood, Prestonia, Gallatin. Pentium IIICoppermine (c. D0- step)8. 05. 34.
Pentium 4 SFFNorthwood (small form factor)8. Pentium M, Celeron M 3.
Banias. 80. 53. 6Pentium M, Celeron M 3. Dothan. 80. 53. 7Core 2 Duo T5xxx, T7xxx, Celeron M 5xx.
Merom. 80. 53. 8Core Solo, Celeron M 4xx. Yonah. 80. 53. 9Core Duo, Pentium Dual- core T- series.
Yonah. 80. 54. 1Itanium. Merced. 80. 54. 2Itanium 2. Mc. Kinley. 80. 54.
Itanium 2. Madison. Pentium 4, Celeron D, Xeon. Prescott (Socket 4. Nocona, Irwindale, Cranford, Potomac.
Pentium 4, Celeron DPrescott (LGA 7. Tejas and Jayhawk. Itanium 2 9. 0xx. Montecito. 80. 55. Dual- core Xeon 7. Tulsa. 80. 55. 1Pentium D, Pentium EE, Dual- core Xeon. Smithfield, Paxville DP8.
Pentium 4, Celeron DCedar Mill. Pentium D, Pentium EEPresler. Celeron 8. 00/9. 00/1. ULVShelton. 80. 55. Dual- core Xeon 5.
Dempsey. 80. 55. 6Dual- core Xeon 5. Woodcrest. 80. 55. Core 2 Duo E4xxx. E6xxx, Dual- core Xeon 3. Pentium Dual- core E2xxx.
Conroe. 80. 56. 0Dual- core Xeon 7. Paxville MP8. 05. Core 2 Quad, Core 2 Extreme QX6xxx, Quad- core Xeon 3. Kentsfield. 80. 56. Quad- core Xeon 5.
Clovertown. 80. 56. Xeon 7. 20. 0Tigerton- DC8. Xeon 7. 30. 0Tigerton. Atom Z5xx. Silverthorne. Itanium 9. 1xx. Montvale. Core 2 Quad Q9xxx, Core 2 Extreme QX9xxx, Xeon 3. Yorkfield. 80. 57.
Core 2 Duo E8xxx, Xeon 3. Wolfdale. 80. 57. Core 2 Duo E7xxx, Pentium Dual- core E5xxx, Pentium Dual- core E2. Wolfdale- 3. M8. 05. Xeon 5. 20. 0Wolfdale- DP8. Core 2 Extreme QX9. Xeon 5. 40. 0Harpertown.
Core 2 Duo P7xxx, T8xxx, P8xxx, T9xxx, P9xxx, SL9xxx, SP9xxx, Core 2 Extreme X9xxx. Penryn. 80. 57. 7Core 2 Duo P7xxx, P8xxx, SU9xxx, T6xxx, T8xxx. Penryn- 3. M8. 05. EP8. 05. 78. Vermilion Range. EP8. 05. 79. Tolapai. Core 2 Quad Q8xxx, Q9xxx, Xeon 3. Yorkfield- 6. M8.
Core 2 Quad Q9xxx. Penryn- QC8. 05. 82. Xeon 7. 4xx. Dunnington. Xeon 7. 4xx. Dunnington- QC8. Xeon X3. 3x. 3 LVYorkfield CL8. Core 2 Solo SU3xxx, Celeron 7xx, 9xx. Penryn- L8. 05. 86.
Atom 2xx, N2xx. Diamondville. Atom 3xx. Diamondville DC8. Xeon L3. 01. 4, E3. Wolfdale- CLIntel 8. Retrieved 2. 01. 0- 0. Ark. intel. com. Archived from the original on 2. Retrieved 2. 01. 0- 0.